CERTIFICATE OF TRANSLATION ACCURACY
`
`|, Peter Niederlohner, declare:
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`1. lama native speaker of German and am well versed in both the German and English
`languages and have over 25 years of experience translating German technical documents into
`English on a full-time basis.
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`2. The following translation of the corresponding source text from German into English is
`accurate and complete to the best of my knowledge.
`
`| declare under penalty of perjury under the laws of the United States of America that the
`foregoing is true and accurate.
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`Statements made herein are to the best of my knowledgetrue and are based on information
`that | believe to be true and further these statements were made with the knowledge that
`willful false statements and the like so made are punishable byfine or imprisonment, or both,
`under Section 1001 ofTitle 18 of the United States Code and that suchwillful false
`statements may jeopardize the validity of the patent application in the United States of
`America or any patent issuing thereon.
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`Executed this 22nd day of May 2024, at Brooklyn, NY.
`
`put Ni ofa
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`Peter Niederlohner
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`SDC EX. 1005 - 1/40
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`SDC EX. 1005 - 1/40
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`(12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY
`(PCT)
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`(19) World Intellectual Property Organization
`International Bureau
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`(43) International publication date
`March 31, 2011 (03/31/2011)
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`PCT
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`(10) International publication number
`WO 2011/036089 Al
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`(51) International patent classification:
` H01L 51/10 (2006.01)
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`Nittendorf (DE). HEUSER, Karsten [DE/DE]; Georg(cid:173)
`Frank-Straße 17, 91056 Erlangen (DE).
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`(21) International file number:
`(22) International filing date:
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`PCT/EP2010/063623 (74) Attorneys: EPPING HERMANN FISCHER PATENT(cid:173)
`ANWALTSGESELLSCHAFT MBH; Ridlerstraße 55,
`80339 Munich (DE).
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` September 16, 2010 (09/16/2010)
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`(25) Filing language:
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`(26) Language of publication:
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` (30) Priority information:
`10 2009 043 066.0
`September 25, 2009 (09/25/2009)
`10 2009 060 066.3
`December 22, 2009 (12/22/2009)
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`German
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`German
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`DE
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`DE
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`(71) Applicant (for all designated states except US): OSRAM
`OPTO
`SEMICONDUCTORS GMBH
`[DE/DE];
`Leibnizstraße 4, 93055 Regensburg (DE).
`
`(72) Inventors; and
`(75) Inventors/applicants (only for US): INGLE, Andrew [US/
`DE]; Anton-Bruckner-Straße 5, 85391 Allershausen (DE).
`SCHLENKER, Tilman [DE/DE]; Jacklberg 17, 93152
`
`
`
`
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`(81) Designated countries (unless otherwise indicated, for
`each available national type of IP right): AE, AG, AL,
`AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY,
`BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM,
`DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM,
`GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN,
`
`KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA,
`MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG,
`NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC,
`SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN,
`TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
`
`(84) Designated countries (unless otherwise indicated, for
`each available regional type of IP right): ARIPO (BW,
`GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG,
`ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, MD, RU, TJ,
`TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE,
`ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC,
`MK, MT, NL, NO, PL, PT, RO,
`
`[Continued on the next page]
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`(54) Title: METHOD FOR PRODUCING AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
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`(57) Abstract: The present invention relates to a method for producing an electronic component having at least one first electrode
`region (21) and a second electrode region (23), said regions being separated from each other by an insulator (9) and each
`comprising at least one partial layer of a first electrically conductive material. The present invention further relates to an electronic
`component that can be produced by means of the method according to the invention.
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`[Continued on the next page]
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`SDC EX. 1005 - 2/40
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`SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM,
`GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
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`Published:
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`with international search report (Art. 21 paragraph 3)
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`
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`The present invention relates to a method for producing an electronic component having at least one first electrode region (21) and
`a second electrode region (23), said regions being separated from each other by an insulator (9) and each comprising at least one
`partial layer of a first electrically conductive material. The present invention further relates to an electronic component t hat can be
`produced by means of the method according to the invention.
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`SDC EX. 1005 - 3/40
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`WO 2011/036089
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`Description
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`- 1 -
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`PCT/EP2010/063623
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`Method for producing an electronic component and electronic
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`component
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`The present invention relates to a method for producing an
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`electronic component and an electronic component.
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` This patent application claims the priorities of German
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`patent application 10 2009 060 066.3 and German patent
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`application 10 2009 043 066.0, the disclosure contents of
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`which are hereby incorporated by reference.
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` In electronic components such as organic light-emitting
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`diodes, insulators are used, among other things, to separate
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`two electrode regions from each other. Suitable insulators
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`such as light-sensitive lacquers are usually very expensive
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`and time-consuming to apply.
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`One task of the present invention is to provide an improved
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`method of producing an electronic component compared to the
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`prior art, in which the insulator is only applied to certain
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`areas of an electrically conductive layer.
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`The task according to the invention is solved by a method
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`having the features of independent claim 1 and an electronic
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`component having the features of independent claim 15.
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`Subclaims indicate further developments of the method
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`according to the invention.
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`SDC EX. 1005 - 4/40
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`WO 2011/036089
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`- 2 -
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`PCT/EP2010/063623
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`The method according to the invention is suitable for
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`producing an electronic component having at least one first
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`electrode region and a second electrode region, which are
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`separated from one another by an insulator and each have at
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` least a partial layer of a first electrically conductive
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`material.
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`The method according to the invention comprises the following
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`steps:
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`A) Providing a substrate layer and at least one first
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`electrically conductive layer of the first electrically
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`conductive material arranged on the substrate layer;
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`B) Arranging at least one second electrically conductive
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`layer of a second electrically conductive material on the
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`first electrically conductive layer;
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`C) Arranging at least one first insulator on the substrate so
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`that the second electrically conductive layer comprises at
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`least a first portion covered with the insulator and a second
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`portion not covered with the insulator, and wherein the
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`insulator is arranged so that it can serve to separate the
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`first electrode portion and the second electrode portion from
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`each other; and
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`D) Arranging at least one functional layer and at least one
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`second electrode layer on the second electrically conductive
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`layer obtained in the preceding step, which is covered in
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`portions with the insulator.
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`The term "electrode region," as used herein, refers to a
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`region or portion of the electronic component or an electrode
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`layer thereof functioning as an electrode. The electrode
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`layer may be an anode layer or a cathode layer.
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`The first and second electrode regions each have at least
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`one partial layer of a first electrically conductive
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`material.
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`SDC EX. 1005 - 5/40
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`WO 2011/036089
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`- 3 -
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`PCT/EP2010/063623
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`The term "electrically conductive material," as used herein,
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`refers to a material or substance with the ability to
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`conduct electric current. The term "partial layer of a first
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`electrically conductive material," as used herein, means
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`that the electrode regions each comprise or consist of a
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`section formed as a layer of the first electrically
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`conductive material. The partial layer formed from the first
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`electrically conductive material is clearly separated from
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`possible further layers, so that, for example, the formation
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`of an alloy between the first electrically conductive
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`material and any further material applied in the respective
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`electrode region is excluded.
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`The term "insulator," as used herein, refers to an
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`insulating substance which is applied in such a way that it
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`prevents a current flow between the first electrode region
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`and the second electrode region. The insulator may be a
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`coating or a coating agent, such as a polymer and in
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`particular a lacquer, and the like.
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`The term "lacquer" is understood here to mean a coating
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`material that can be applied in liquid or powder form.
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`The term "first electrically conductive layer," as used
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`herein, means a layer comprising the first electrically
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`conductive material or a layer consisting of the first
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`electrically conductive material which is deposited directly
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`on the substrate layer. The first electrically conductive
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`layer may be a transparent conductive layer. It may be
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`formed of, but is not limited to, a transparent conductive
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`oxide (TCO), e.g. indium-doped tin oxide (ITO) or ZnO,
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`In/ZnO, SnZnO, Al-ZnO and the like.
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`SDC EX. 1005 - 6/40
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`WO 2011/036089
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`- 4 -
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`PCT/EP2010/063623
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`The first electrically conductive layer can be applied to
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`the substrate layer by sputtering, for example.
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` A second electrically conductive layer made of a "second
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`electrically conductive material," which is usually different
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`from the first electrically conductive material, is deposited
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`on the first electrically conductive layer. For example, the
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`first electrically conductive material may be provided in
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`particular for the anode of the finished device, the second
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`electrically conductive material may be provided for the
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`cathode and vice versa. Examples of the second electrically
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`conductive material include but are not limited to metals
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`such as aluminum, barium, indium, copper, silver, gold,
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`magnesium, calcium and lithium and the like, as well as
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`mixtures or combinations thereof, particularly in the form of
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`alloys with each other or with other metals. The second
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`electrically conductive layer can comprise only one but also
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`several sub-layers. The individual sub-layers can then
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`consist of or contain the aforementioned materials
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`independently of each other; in addition to the metals
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`explicitly listed above, they can also contain or consist of
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`25
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`the metals chromium and molybdenum. Examples of layer
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`sequences in a second electrically conductive layer
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`comprising several partial layers are Mo/Al/Mo, Cr/Al/Cr,
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`Cu/Cr and Cr/Cu.
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`The second electrically conductive layer can be applied to
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`the first electrically conductive layer by means of
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`sputtering, physical vapor deposition (PVD) or the like.
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`The term "substrate layer," as used herein, refers to a
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`layer of a substrate as conventionally used, for example, in
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`the prior art for an electronic component.
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`- 5 -
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`PCT/EP2010/063623
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`The substrate may be a transparent or a non-transparent
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`substrate. For example, the substrate may comprise glass,
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`quartz, sapphire, plastic foils, coated plastic foils,
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`metal, metal foils, metal foils, foils coated with an
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`electrically insulating layer, silicon wafers or another
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`suitable substrate material. According to the invention, the
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`substrate layer is understood in particular to be the layer
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`to which all other layers are subsequently applied during
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`the production of the electronic component. Such subsequent
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`layers may, for example, be layers required for radiation
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`emission in the case of an optical electronic component, for
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`example a radiation-emitting device.
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`The "second electrode layer" may comprise a material or be
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`formed from a material selected from metals such as
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`aluminum, barium, indium, silver, gold, magnesium, calcium
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`and lithium, as well as combinations thereof or a compound
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`thereof, in particular an alloy, as well as transparent
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`conductive oxides, such as metal oxides such as zinc oxide,
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`tin oxide, cadmium oxide, titanium oxide, indium oxide or
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`indium-doped tin oxide (ITO), aluminum-doped zinc oxide
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`(AZO), Zn2SnO4, CdSnO3, Mgin2O4, GaInO3, Zn2In2O5 or In4Sn3O12 or
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`mixtures of different transparent conductive oxides. The
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`second electrode layer is preferably made of a metal. The
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`second electrode layer of the electronic component can be a
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`cathode layer.
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`A "functional layer" of the electronic component performs a
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`function characteristic of the electronic component. For
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`example, functional layers can be radiation-emitting layers,
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`such as fluorescent and/or phosphorescent emitter layers of
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`an organic light-emitting diode.
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`SDC EX. 1005 - 8/40
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`WO 2011/036089
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`- 6 -
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`PCT/EP2010/063623
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`An "electronic component" which can be produced by the method
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`according to the invention can be, but is not limited to, a
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`transistor, a capacitor, a thermistor, an organic electronic
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`component, such as an organic light-emitting diode, a solar
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`cell, and the like.
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`With the method according to the invention, it is possible
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`to separate two electrode regions from one another, wherein
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`the electrode regions are structured at a preselected
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`position already during the application of the layers of the
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`electrode regions or later and the insulator applied to the
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`second electrically conductive layer is arranged in the
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`region formed by the structuring. The structuring is usually
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`applied later.
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`If the structuring is already present (i.e. is applied
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`"earlier"), this can be done by applying the first and
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`second electrically conductive layers or parts thereof to
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`the substrate, for example by printing, by deposition with
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`the aid of SAMs (self-assembling monolayers) and the like.
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`The insulator is applied (usually exclusively) to the second
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`electrically conductive layer.
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`According to the invention, it is provided that the
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`insulator is applied to the second electrically conductive
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`layer only in predetermined areas or sections.
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`Depending on the composition of the insulator, the insulator
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`can be placed only in the first section of the second
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`electrically conductive layer using a pressure process, a
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`syringe, a nozzle, a grommet and the like.
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`SDC EX. 1005 - 9/40
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`WO 2011/036089
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`- 7 -
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`After completion of the electronic component, the first
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`partial area can serve as a bond pad or bus bar for
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`subsequent contacting of the electronic component.
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`The second electrically conductive layer is divided into at
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`least two partial areas by means of the insulator applied to
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`the substrate, one of which is covered with insulator and
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`the other is not covered. At the same time, the insulator is
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`arranged in such a way that it can serve to separate the
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`first and second electrode areas of the first electrically
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`conductive layer from one another. In particular, this also
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`means that in a later process step the insulator is brought
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`into a formable state which allows the insulator to be
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`arranged in such a way that the electrode regions are
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`separated from one another by the insulator.
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`The method according to the invention for producing an
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`electronic component can be used to produce electronic
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`components with cost and time savings. Since each layer of the
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`component can be applied individually and, if necessary,
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`structured according to desire or purpose (as can be seen from
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`the following further developments of the method), time-
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`consuming coating or application steps can thus be avoided and
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`(often expensive) material can also be saved.
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`By applying the second electrically conductive layer over
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`the entire surface of the first electrically conductive
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`layer in accordance with the invention, it is also possible
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`to prevent the first electrically conductive layer, such as
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`a sensitive ITO layer, from coming into contact with the
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`insulator to be printed and/or the protective material and
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`possibly being damaged or impaired.
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`- 8 -
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`PCT/EP2010/063623
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`Furthermore, the first electrically conductive layer does
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`not come into direct contact with the equipment.
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`Furthermore, the first electrically conductive layer can in
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`particular be kept free of particles, such as impurities,
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`since during etching of the second electrically conductive
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`layer, any impurities on top, such as residues that may
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`arise due to the redeposition of any laser ablation process
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`that may have been carried out, are removed.
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`Using the method according to the invention, it is possible
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`to achieve "self-aligning" of the second electrically
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`conductive material and the insulator. In this way, it is
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`possible, for example, to easily provide conductive tracks
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`or bond pads in the electronic component produced according
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`to the invention.
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`In a further development of the method according to the
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`invention, the method comprises the following step:
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`E) Removing first electrically conductive material of the
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`first electrically conductive layer at least along a
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`predetermined separation region between the first electrode
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`region and the second electrode region.
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`This step of removal is usually performed after step A) and
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`before step B).
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`The predetermined separation region may be a kind of trench or
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`gap between the first and second and any further electrode
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`region of the first electrically conductive layer formed by
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`removing the first electrically conductive material.
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`Alternatively, it is possible to remove both the first
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`electrically conductive material of the first electrically
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`conductive layer
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`SDC EX. 1005 - 11/40
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`WO 2011/036089
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`- 9 -
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`PCT/EP2010/063623
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`and the second electrically conductive material of the second
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`electrically conductive layer located above the first
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`electrically conductive material at least along a
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`predetermined separation region between the first electrode
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`region and the second electrode region (step F)).
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`This step is usually carried out after step B) and before
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`step C).
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`Removal of both the first and the second electrically
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`conductive material can preferably be carried out
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`simultaneously, i.e. in one step.
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`In a further development of the method according to the
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`invention, the method according to the two preceding
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`alternatives comprises removing the first electrically
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`conductive material (step E)) or removing the first
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`electrically conductive material and the second electrically
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`conductive material (step F)) by laser ablation.
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`The term "laser ablation," as used herein, includes ablation
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`of the first electrically conductive material or ablation of
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`the first and second electrically conductive materials from
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`the surface of the substrate layer by bombardment with
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`pulsed laser radiation.
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`During the essentially sectional removal or ablation of the
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`second electrically conductive layer and the first
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`electrically conductive layer by means of laser ablation,
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`only the uppermost, i.e. the second electrically conductive
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`35
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`layer, heats up in particular. This can be particularly
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`advantageous in order to protect the first electrically
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`conductive layer, for example an ITO layer, which is
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`generally a very sensitive layer.
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`SDC EX. 1005 - 12/40
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`WO 2011/036089
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`- 10 -
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`PCT/EP2010/063623
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`In a further development of the method according to the
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`invention, the method further comprises the step G) of
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`arranging at least one protective material in at least a
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`third sub-region of the second electrically conductive layer
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`arranged in the second sub-region.
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`The term "protective material," as used herein, refers to a
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`material or substance which serves to protect the second
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`electrically conductive material of the second electrically
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`conductive layer in the partial areas to which it has been
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`applied on the second electrically conductive layer, in
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`particular in the further process sequence of producing the
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`electronic component, i.e. in further process steps.
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`The protective material can be a coating such as a lacquer
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`and the like. In particular, the protective material can be
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`an alkali-soluble etch-stop lacquer, for example an etch-
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`stop lacquer such as is used in the production of printed
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`circuit boards (PCBs). This etch-stop lacquer can be cross-
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`linked or hardened thermally or by means of UV radiation.
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`The protective material is preferably soluble in a solvent
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`in which the insulator is not soluble. Examples include
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`alkaline solutions such as weakly alkaline aqueous solutions
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`of salts, etc. (e.g. NaOH, KOH, NH4OH, or quaternary ammonium
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`salts such as N(CH3)4OH).
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`The protective material can be applied either after the
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`second electrically conductive layer has been applied to the
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`first electrically conductive layer and before the insulator
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`has been applied to the second electrically conductive
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`layer, or after the insulator has been applied to the second
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`electrically conductive layer and before a functional layer
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`has been applied to the second electrically conductive
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`layer.
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`SDC EX. 1005 - 13/40
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`WO 2011/036089
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`- 11 -
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`PCT/EP2010/063623
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`The protective material is applied in such a way that the
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`second electrically conductive layer is covered with
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`5
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`protective material in the third partial area and is not
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`covered with the protective material and not with the
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`insulator in at least one fourth partial area, which is
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`arranged in the second partial area.
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`The protective material can be arranged—at least in sections—
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`over or on the insulator.
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`In a further development of the method according to the
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`invention, the protective material is arranged on the second
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`partial area at a distance from the insulator so that a gap
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`remains between the first partial area and the third partial
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`area. In this embodiment, the protective material is not
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`arranged on the insulator.
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`A "distance" at which the protective material is arranged in
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`relation to the insulator can be a predetermined distance.
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`The "gap," which is created by arranging the protective
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`material at a distance from the insulator, can be an area
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`that corresponds to the separation area or the separation
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`line between the first and second electrode areas.
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`According to this further development of the method according
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`to the invention, it is provided that at least a part of the
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`first electrically conductive material of the first
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`electrically conductive layer and of the second electrically
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`conductive material of the second electrically conductive
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`35
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`layer, which are located in the region of the gap as described
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`above, are removed. The first electrically conductive material
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`of the first electrically conductive layer to be removed and
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`the second electrically conductive material of the second
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`electrically conductive layer are generally located below the
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`gap.
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`SDC EX. 1005 - 14/40
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`WO 2011/036089
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`- 12 -
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`PCT/EP2010/063623
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`In a further development of the method according to
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`the invention for producing the electronic
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`component, the method comprises the following step:
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`H) at least partially removing the second electrically
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`conductive layer in at least the fourth partial area.
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`This step H) can take place either after step C) and
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`before step D) or after step G) and before step D).
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`The second electrically conductive material is essentially
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`removed in the fourth partial area of the second partial
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`area, i.e. in the area which is neither covered by protective
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`material nor by insulator. By removing the second
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`electrically conductive material, the first electrically
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`conductive layer lying under the second electrically
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`conductive layer is exposed (and not removed) in the area of
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`the fourth partial area of the second electrically conductive
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`layer. The removal is thus carried out using a technique that
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`selectively removes only one layer, e.g. a metal layer.
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` In a further development of the method according to the
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`invention for producing the electronic component, the
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`second electrically conductive layer is removed by
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`etching.
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`The etching of the second electrically conductive material
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`can be carried out by means of an etching bath.
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`The term "etching," as used herein, refers to the removal of the
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`second electrically conductive material on the surface of the
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`first electrically conductive layer by applying suitable etching
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`substances; these may be chemical substances that modify
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`SDC EX. 1005 - 15/40
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`

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`WO 2011/036089
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`- 13 -
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`PCT/EP2010/063623
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`(usually oxidize) the material to be removed in a chemical
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`reaction and thus generally dissolve it. Etchants are usually
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`acids or strong oxidizing agents. Examples include HNO3, HCl,
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`H3PO4, acetic acid, H2SO4, ceric ammonium nitrate (CAN) and H 202.
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`In one such embodiment, both the insulator and the
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`protective material are resistant to the chemicals, such as
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`acids, used for etching the second electrically conductive
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`material. The insulator and the protective material provide
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`an etch-stop function for the second electrically conductive
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`layer or the second electrically conductive material in the
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`corresponding areas of the second electrically conductive
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`layer in the areas of the second electrically conductive
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`layer to which they are applied.
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`Furthermore, the etching bath is selected in such a way that
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`the first electrically conductive layer, for example a
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`sensitive ITO layer, is not attacked or impaired by the
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`etchants used.
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`By etching the second electrically conductive material, the
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`structures of the first electrically conductive layer and the
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`second electrically conductive layer located under the
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`insulator layer and/or under the protective material layer are
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`maintained.
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`An advantage of the method according to the invention may be
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`that only a single etching step is required to remove the
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`second electrically conductive material in the fourth
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`subregion of the second electrically conductive layer arranged
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`in the second subregion of the second electrically conductive
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`layer, thus exposing parts of the first electrically
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`conductive layer as first and second electrode regions.
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`SDC EX. 1005 - 16/40
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`35
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`WO 2011/036089
`
`- 14 -
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`PCT/EP2010/063623
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`In a further development of the method according to the
`
`invention, the method comprises the following step:
`
`I) Removing the protective material from the second
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`electrically conductive layer.
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`The protective material is removed from the second
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`electrically conductive layer after step H).
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`Since the insulator is only applied to the second electrically
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`conductive layer at specific, predetermined points, a non -
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`electrically conductive material, the protective material, may
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`only have to be removed once in the method according to the
`
`invention. The protective material used can generally be
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`removed with the aid of a suitable solvent instead of being
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`removed by means of etching, as may be common in the prior
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`art.
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`The protective material can also be removed by stripping, for
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`example. The term "stripping" refers to the ashing or removal
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`of protective material, such as a (photo)lacquer. As a rule,
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`an oxygen plasma is used in the so-called stripper or asher to
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`burn off the (photo)lacquer.
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`By removing the protective material from the second
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`electrically conductive layer, the second electrically
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`conductive material is completely exposed. The exposed areas
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`of the second electrically conductive layer can be used as the
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`second electrode of the electronic component. They can form
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`part of the second electrode or serve completely as the second
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`electrode.
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`In a further development of the method according to the
`
`invention, the insulator is applied directly to the second
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`electrically conductive layer and arranged on the second
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`electrically conductive layer in such a way that it is
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`located in the immediate vicinity of the separation region
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`between the first electrode region and the second electrode
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`region. The term "in the immediate vicinity" means that the
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`SDC EX. 1005 - 17/40
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`

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`WO 2011/036089
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`PCT/EP2010/063623
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`- 15 -
`insulator is spatially applied to the second electrically
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`conductive layer in such a way that it is able to flow into
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`the separation region between the first electrode region and
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`the second electrode region by a subsequent treatment such
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`as softening. For example, the insulator may be arranged
`
`such that its distance from the separation region is not
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`greater than the width of the separation region.
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`The insulator can be applied to the second electrically
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`conductive layer in a predetermined pattern. For example,
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`such a pattern can be predetermined by means of coordinates
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`or the like before the insulator is applied. The insulator
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`can be applied to the second electrically conductive layer
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`15
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`by means of a mask or a stencil or defined coordinates which
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`35
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`are related to the surface of the second electrically
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`conductive layer as a reference system.
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`By applying the insulator and the protective material at
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`specific points by means of a printing process, it is also
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`possible to reduce or eliminate the risk of errors caused by
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`incorrect alignment of the photolithographic system during
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`the application of the photosensitive lacquers.
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`In a further development of the method according to the
`
`invention, the insulator is applied to the second
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`electrically conductive layer by means of a printing
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`process. Suitable printing processes include planographic,
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`relief, intaglio and screen-printing processes as well as
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`combinations thereof. In particular, the insulator can be
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`printed onto the second electrically conductive layer by
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`means of screen printing, inkjet printing, flexographic
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`printing and the like.
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`SDC EX. 1005 - 18/40
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`

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`WO 2011/036089
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`
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`- 16 -
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`PCT/EP2010/063623
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`Other suitable printing methods include pad printing, stamp
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`printing, pochoir and the like.
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`The protective material can also be printed onto the second
`
`electrically cond